Trends in Wafer Cleaning
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Wafer Cleaning: Wet Methods Still Lead the Pack
As feature sizes continue their frantic descent into the sub-0.6 pm region, wafer cleaning is on its way toward becoming a true enabling technology. Ridding wafers of the i r process chemicals is one of the most common steps in fabrication. It’s also, often a dirty one, in terms of picking up contaminants. The heavy metals, alkali metals and light elements, all common to wafer processing, also ...
متن کاملThe Evolution of Silicon Wafer Cleaning Technology
The purity of wafer surfaces is an essential requisite for the successful fabrication of VLSI and ULSI silicon circuits. Wafer cleaning chemistry has remained essentially unchanged in the past 25 years and is based on hot alkaline and acidic hydrogen peroxide solutions, a process known as "RCA Standard Clean." This is still the primary method used in the industry. What has changed is its implem...
متن کاملInvited paper Semiconductor cleaning technology for next generation material systems
This paper gives a brief overview of the challenges wafer cleaning technology is facing in the light of advanced silicon technology moving in the direction of non-planar device structures and the need for modified cleans for semiconductors other than silicon. In the former case, the key issue is related to cleaning and conditioning of vertical surfaces in next generation CMOS gate structure as ...
متن کاملSource Reduction of Chlorinated Solvents in Electronics Industry
Chlorinated solvents are a class of interrelated chemicals that have gone through major regulatory scrutiny in recent years. A number of chlorinated solvents are used in the electronics industry in printed circuit board (PCB) fabrication and assembly; semiconductor wafer fabrication and assembly; and critical cleaning applications. The growth in the electronics industry in the last few decades ...
متن کاملSUBSTITUTING FOR CFCs USED AS CLEANING AGENTS: (1) PARTICLE REMOVAL
Freon-TF is no better a cleaning fluid than deionized water for removing either organic (polystyrene latex spheres) or inorganic (glass beads) particles from silicon wafer surfaces, as shown by comparative measurements of cleaning efficiencies in both an ultrasonic bath and a hydrodynamic cleaning apparatus. A primary reason for this lackluster performance is the higher van der Waals’ forces of...
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تاریخ انتشار 2003